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| Product Name: |
3.2mm,20L blind/burid vias
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| Supply Ability: |
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| Related proudcts |
rigid board, flex-rigid board, flex board, |
| Specifications |
3.2mm,20L blind/burid vias |
| Price Term: |
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| Port of loading: |
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| Minimum Order |
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| Unit Price: |
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layer count£º20L
base material£º FR-4 TG170
copper thickness£º all layers 2OZ
board thickness£º 3.2mm¡À0.3mm
min hole diameter£º 0.50mm(19mil)
min trace width£º 0.20mm(8mil)
min trace ***cing£º 0.20mm(8mil)
suface finishing£º ENIG
test£º flying probe
panel dimension£º 106.63mmX134.42 mm
panel method£º 6up, 2*3
blind£ºdr1-2£¬dr3-4, 2 step blind vias
via diameter: 0.5mm(19mil)
lead time£ºfastest 10wds£¬normal 15-20 wds |
| Company: |
Shenzhen HeMeiXin Electronic Co., Ltd
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| Contact: |
Ms. Caroline Huang |
| Address: |
South Of 5th Floor, 7 Building, Wanxia Industrial Park, Tongfuyu Industrial Area, Shajing St., Baoan Dist. , Shenzhen,China |
| Postcode: |
518101 |
| Tel: |
86-0755-29920122 |
| Fax: |
86-0755-29922262 |
| E-mail: |
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